Features and specifications

Use this information to view specific information about the compute node, such as compute node hardware features and the dimensions of the compute node.

Notes:
  1. Power, cooling, and chassis systems management are provided by the Lenovo Flex System chassis.
  2. The operating system in the compute node must provide USB support for the compute node to recognize and use USB media drives and devices.

The following is a summary of the features and specifications of the Lenovo Flex System x280 X6, x480 X6, and x880 X6 compute node.

Microprocessor:
Two multi-core Intel Xeon microprocessors.
Note: Use the Setup utility to determine the type and speed of the microprocessors in the compute node.
Integrated functions:
  • Renesas SH7757 (IMM2) baseboard management controller (BMC) with integrated VGA controller
  • (Models with LAN-on-motherboard (LOM) only) Two LOM fabric connectors and one Emulex Skyhawk Quad-Port 10 Gigabit Ethernet controller
  • Support for up to two internal USB ports
  • One external USB port
  • One LSI 3004 SAS controller with support for RAID level-0 or RAID level-1
  • Light path diagnostics
  • Automatic server restart (ASR)
  • Four I/O expansion connectors
  • (Models without LOM) Four I/O expansion connectors
  • (Models with LOM) Support for two I/O expansion connectors
  • Serial over LAN (SOL)
  • Wake on LAN (WOL)
  • Wake on PCI (PME) capability
  • Built-in monitoring for temperature, voltage, and hard disk drives
  • Advanced Configuration and Power Interface (ACPI)
Upgradeable firmware:
All firmware is field upgradeable.
Memory:
  • 48 dual inline memory module (DIMM) connectors
  • Type: Low-profile (LP) double-data rate (DDR3) DRAM
  • Supports 8 GB, 16 GB, 32 GB, and 64 GB DIMMs with up to 3 TB of total memory on the system board per compute node
  • Support for RDIMMs and LRDIMMs (combining is not supported)
  • Vital product data (VPD)
Drives:
  • Support for up to two 2.5-inch hot-swap, small form factor (SFF) Serial Attached SCSI (SAS) or Serial ATA (SATA) hard disk drives, or up to two 2.5-inch hot-swap solid state drives (SSDs)
  • Optional support for up to four 1.8-inch hot-swap SSDs
  • Optional RAID controller supports up to four 1.8-inch hot-swap SSDs and up to four non-hot-swap 1.8-inch SSDs
Drives:
Support for up to two 2.5-inch hot-swap, small form factor (SFF) Serial Attached SCSI (SAS) or Serial ATA (SATA) hard disk drives, or up to two 2.5-inch hot-swap solid state drives (SSDs).
eXFlash DIMMs:
Supports a maximum of 12 DDR3 eXFlash DIMMs in 200 GB or 400 GB capacities.
Scalability:
Supports scaling to form two-node or four-node complexes, providing up to eight microprocessor sockets and 192 DIMM connectors.
Predictive Failure Analysis (PFA) alerts:
  • Microprocessors
  • Memory
  • Hard disk drives
Size:
  • Height: 55.5 mm (2.19 in)
  • Depth: 500 mm (19.7 in)
  • Width: 435.3 mm (17.14 in)
  • Maximum weight: 12.25 kg (27 lbs)
Security:
Fully compliant with NIST 800-131A. The security cryptography mode set by the managing device (CMM, Lenovo XClarity Administrator, or Flex System Manager management node) determines the security mode in which the compute node operates.
Environment:
The Lenovo Flex System x280 X6, x480 X6, and x880 X6 Compute Node complies with ASHRAE class A3 specifications.
  • Power on1:
    • Temperature: 5°C - 40°C (41°F - 104°F) up to 950m (3,117ft)3
    • Humidity, non-condensing: -12°C dew point (10.4°F) and 8% - 85% relative humidity5,6
    • Maximum dew point: 24°C (75°F)
    • Maximum altitude: 3048 m (10,000 ft)
    • Maximum rate of temperature change: 5°C/hr (41°F/hr )4
  • Power off2:
    • Temperature: 5°C to 45°C (41°F - 113°F)
    • Relative humidity: 8% - 85%
    • Maximum dew point: 27°C (80.6°F)
  • Storage (non-operating):
    • Temperature: 1°C to 60°C (33.8°F - 140°F)
    • Altitude: 3050 m (10,006 ft)
    • Relative humidity: 5% - 80%
    • Maximum dew point: 29°C (84.2°F)
  • Shipment (non-operating)7:
    • Temperature: -40°C to 60°C (-40°F - 140°F)
    • Altitude: 10,700 m (35,105 ft)
    • Relative humidity: 5% - 100%
    • Maximum dew point: 29°C (84.2°F)8
  • Particulate contamination
    Attention: Airborne particulates and reactive gases acting alone or in combination with other environmental factors such as humidity or temperature might pose a risk to the compute node. For information about the limits for particulates and gases, see Particulate contamination.
  1. Compute Node powered on.
  2. Compute Node is removed from original shipping container and is installed but not in use, for example, during repair, maintenance, or upgrade.
  3. A3 - Derate maximum allowable temperature 1°C/175 m above 950 m. At maximum altitude of 3,050m (10kft) maximum air temperature is 28°C (82°F)
  4. 5°C/hr for data centers employing tape drives and 20°C/hr for data centers employing disk drives.
  5. The minimum humidity level for class A3 is the higher (more moisture) of the -12 °C dew point and the 8% relative humidity. These intersect at approximately 25°C. Below this intersection (~25C), the dew point (-12 °C) represents the minimum moisture level; above the intersection , relative humidity (8%) is the minimum.
  6. Moisture levels lower than 0.5°C DP, but not lower -10 °C DP or 8% relative humidity, can be accepted if appropriate control measures are implemented to limit the generation of static electricity on personnel and equipment in the data center. All personnel and mobile furnishings and equipment must be connected to ground via an appropriate static control system. The following items are considered the minimum requirements:
    1. Conductive materials (conductive flooring, conductive footwear on all personnel who go into the datacenter; all mobile furnishings and equipment will be made of conductive or static dissipative materials).
    2. During maintenance on any hardware, a properly functioning wrist strap must be used by any personnel who contacts IT equipment.
  7. The equipment acclimation period is 1 hour per 20°C of temperature change from the shipping environment to the operating environment.
  8. Condensation is acceptable, but not rain.
  9. The fully configured chassis weight is based on all nodes and I/O modules being at their maximum design limit.
Parent topic: Introduction