Features and specifications

Use this table to view specific information about the PCIe Expansion Node, such as PCIe Expansion Node hardware features and the dimensions of the PCIe Expansion Node.

The following table is a summary of the features and specifications of the PCIe Expansion Node.

Table 1. Features and specifications
Integrated functions:
  • The PCIe Expansion Node attaches to a compute node through the interposer cable to allow the addition of expansion PCIe adapters such as:
    • Solid-state drives
    • Graphics accelerators
    • PCIe storage expansion, including host bus adapters and RAID adapters
  • Supports standard PCIe adapters, including:
    • 1x, 2x, 4x, 8x, and 16x PCIe lane widths1
    • Generation 1, generation 2, and generation 3 complaint adapters 2
    • Standard height adapters: 106.7 mm (4.20 in)
    • Low-profile adapters: 64.4 mm (2.536 in)
    • Half-length adapters: 167.65 mm (6.6 in)
    • Full-length adapters: 312 mm (12.283 in).
    Note: When shorter than full-length adapters are used in the full-length slots, extension brackets must be used to securely retain the adapter in the full-height riser.
  • Supports PCIe standards 1.1 and 2.0
  • Supports PCIe adapters greater than 75 W. The PCIe Expansion Node system board includes two standard 2x3, six-pin power connectors with more than 75 W each for additional power.
  • Light path diagnostics
Optional devices:
  • Supports up to four installed PCIe adapters:
    • Up to four low-profile adapters (low-profile adapters equipped with the correct extension bracket will fit in the full-height slots)
    • Up to two full-height adapters or one full-height double-wide adapter
  • The PCIe Expansion Node supports two additional I/O adapters

Electrical input: Receives 12 V dc power from the chassis midplane (+12.2 V nominal, +/- 3%)

Size:
  • Height: 55.5 mm (2.18 in)
  • Depth: 492 mm (19.37 in)
  • Width: 217.35 (8.55 in)
  • Maximum weight: 6.82 kg ( 13.84 lb)

Declared sound power level: When the M2090 adapter is added to the PCIe Expansion Node and installed in the Flex System Enterprise Chassis, the acoustical sound power levels will increase from 7.5 bels to 8.6 bels for the single chassis.
Environment: The PCIe Expansion Node complies with ASHRAE class A3 specifications.
  • Power on 3:
    • Temperature: 5°C - 40°C (41°F - 104°F) 5, 11
    • Humidity, non-condensing: -12°C dew point (10.4°F) and 8% - 85% relative humidity 7,8
    • Maximum dew point: 24°C (75°F)
    • Maximum altitude: 3048 m (10,000 ft)
    • Maximum rate of temperature change: 5°C/hr (41°F/hr ) 6
  • Power off 4:
    • Temperature: 5°C to 45°C (41°F - 113°F)
    • Relative humidity: 8% - 85%
    • Maximum dew point: 27°C (80.6°F)
  • Storage (non-operating):
    • Temperature: 1°C to 60°C (33.8°F - 140°F)
    • Altitude: 3050 m (10,006 ft)
    • Relative humidity: 5% - 80%
    • Maximum dew point: 29°C (84.2°F)
  • Shipment (non-operating) 9:
    • Temperature: -40°C to 60°C (-40°F - 140°F)
    • Altitude: 10,700 m (35,105 ft)
    • Relative humidity: 5% - 100%
    • Maximum dew point: 29°C (84.2°F) 10

Notice: Government regulations (such as those prescribed by OSHA or European Community Directives) may govern noise level exposure in the workplace and may apply to you and your server installation. This IBM system is available with an optional acoustical door feature that can help reduce the sound emitted from this system. The actual sound pressure levels in your installation depend upon a variety of factors, including the number of racks in the installation; the size, materials, and configuration of the room; the noise levels from other equipment; the room ambient temperature, and employees' location in relation to the equipment. Further, compliance with such government regulations also depends upon a variety of additional factors, including the duration of employees' exposure and whether employees wear hearing protection. IBM recommends that you consult with qualified experts in this field to determine whether you are in compliance with the applicable regulations.
  1. PCIe mechanical connectors limit larger lane add-in cards from being inserted into smaller mechanical connectors.
  2. Generation 3 compliant cards operate using generation 2 compliance.
  3. PCIe Expansion Node is powered on.
  4. PCIe Expansion Node is removed from original shipping container and is installed but not in use, for example, during repair, maintenance, or upgrade.
  5. A3 - Derate maximum allowable temperature 1°C/175 m above 950 m.
  6. 5°C/hr for data centers employing tape drives and 20°C/hr for data centers employing disk drives.
  7. The minimum humidity level for class A3 is the higher (more moisture) of the -12 °C dew point and the 8% relative humidity. These intersect at approximately 25°C. Below this intersection (~25C) the dew point (-12 °C) represents the minimum moisture level, while above it relative humidity (8%) is the minimum.
  8. Moisture levels lower than 0.5°C DP, but not lower -10 °C DP or 8% relative humidity, can be accepted if appropriate control measures are implemented to limit the generation of static electricity on personnel and equipment in the data center. All personnel and mobile furnishings and equipment must be connected to ground via an appropriate static control system. The following items are considered the minimum requirements:
    1. Conductive materials (conductive flooring, conductive footwear on all personnel that go into the datacenter, all mobile furnishings and equipment will be made of conductive or static dissipative materials).
    2. During maintenance on any hardware, a properly functioning wrist strap must be used by any personnel who contacts IT equipment.
  9. The equipment acclimation period is 1 hour per 20 °C of temperature change from the shipping environment to the operating environment.
  10. Condensation is acceptable, but not rain.
  11. For some PCIe adapters, the M2090 adapter for example, when running in A3 conditions greater than 35 C, the performance of the adapter might be reduced to keep the adapter within thermal limits.
Parent topic: Introduction