Installing a DIMM

Use this information to install a DIMM.

This component can be installed as an optional device or as a CRU. The installation procedure is the same for the optional device and the CRU.

After you install or remove a DIMM, you must change and save the new configuration information by using the Setup utility. When you turn on the compute node, a message indicates that the memory configuration has changed. Start the Setup utility and select Save Settings (see Using the Setup utility for more information) to save changes.

If you are installing a DIMM as a result of a DIMM failure, you might have to re-enable the DIMM. To re-enable the DIMM, complete the following steps:

1. Verify that the amount of installed memory is the expected amount of memory through the operating system, by watching the monitor as the compute node starts, by using the CMM sol command, or through Flex System Manager management software.
   • For more information about the CMM sol command, see the "Flex System Chassis Management Module: Command-Line Interface Reference Guide".
   • For more information about Flex System Manager management software, see the "Flex System Manager Software: Installation and Service Guide".
2. Run the Setup utility to re-enable the DIMMs (see Using the Setup utility for more information).

The compute node has a total of 48 dual inline memory module (DIMM) connectors. The compute node supports low-profile (LP) DDR3 DIMMs with error-correcting code (ECC) in 8 GB, 16 GB, 32 GB, and 64 GB capacities.

The following illustration shows the system-board components, including the DIMM connectors.

The DDR-3 DIMMs are accessed internally through the integrated memory controllers on the microprocessors. Each microprocessor controls 24 DIMMs. Eight scalable memory buffers provide the interface between the microprocessor memory controller and the DIMMs. The scalable memory controllers interface using one scalable memory interconnect 2 (SMI2) channel. Each SMI2 channel supports two DDR-3 memory buses and each DDR-3 bus connects to up to three DIMMs.

Table 1. Memory-channel configuration.

Microprocessor	SMI2 channel	Scalable memory buffer	DDR channel	DIMM connector
Microprocessor 1	SMI00	JC00	DDR0	28
				29
				30
			DDR1	25
				26
				27
	SMI1	JC01	DDR0	4
				5
				6
			DDR1	1
				2
				3
	SMI2	JC02	DDR0	33
				32
				31
			DDR1	36
				35
				34
	SMI3	JC03	DDR0	10
				11
				12
			DDR1	7
				8
				9
Microprocessor 2	SMI0	JC10	DDR0	15
				14
				13
			DDR1	18
				17
				16
	SMI1	JC11	DDR0	40
				41
				42
			DDR1	37
				38
				39
	SMI2	JC12	DDR0	21
				20
				19
			DDR1	24
				23
				22
	SMI3	JC13	DDR0	45
				44
				43
			DDR1	48
				47
				46

The following notes describe information that you must consider when you install memory:

• Only 8 GB and 16 GB RDIMMs are supported if you also install eXFlash DIMMs.
• You cannot mix RDIMMs and LRDIMMs in the same compute node.
• You cannot mix RDIMMs and LRDIMMs in a scalable partition within a multi-node complex.
• A total of eight ranks on each channel is supported.
• DIMMs of mixed speed can be installed on different DIMM slots within the same channel, but the DIMMs operate at the speed of the slowest DIMM.
• If you install a quad-rank or octal-rank DIMM, install it in the connector at the end of the memory channel.
• If a channel has one or more quad-rank RDIMMs, only two DIMMs per channel are supported. The quad-rank, eight rank per channel limitation only applies to RDIMMs. You can install three quad-rank LRDIMMs because the microprocessor accesses LRDIMMs as dual-rank DIMMs.

There are two memory modes:

• Independent-channel mode: Independent-channel mode provides high performance memory capability. The memory channels can be populated with DIMMs in any order in independent mode. You can populate all four channels on each microprocessor in any order with no matching requirements. Individual channels can run at different DIMM timings, but all channels must run at the same interface frequency.

• Lockstep mode: Lockstep mode provides extensive memory protection through double device data correction (DDDC). DDDC allows up to two sequential memory DRAM chip failures without affecting overall system performance. The memory controller handles all cache lines across two DDR3 channels controlled by one scalable memory buffer. The SMI2 channel operates at the DDR3 transfer rate.

Optionally, you can enable mirrored-channel memory or rank-sparing memory to provide additional reliability:

• Mirrored-channel memory: In mirrored-channel memory, the contents of memory is mirrored between SMI2 channels. As a result, the total available memory is half of the physical memory installed. The maximum effective memory is 1.5 TB (using 64 GB DIMMs). To enable mirrored-channel memory, memory on each SMI2 channel must be populated with DIMMs that have the same feature set (capacity, type, and rank count). The DIMM channels can have memory with different feature sets, but the DIMM slots across each SMI2 channel must be populated with DIMMs that have the same feature set.
• Rank-sparing memory: In rank-sparing memory, one memory DIMM rank serves as a spare of the other ranks on the same channel. The spare rank is held in reserve and is not used as active memory. The spare rank must have identical or larger memory capacity compared to all the other active DIMM ranks on the same channel. After an error threshold is surpassed, the contents of that rank are copied to the spare rank. The failed rank of DIMMs is taken offline, and the spare rank is put online and used as active memory in place of the failed rank.
  The following notes describe additional information that you must consider when you select rank-sparing memory:

  • A minimum of two single-rank DIMMs per channel must be populated to use rank-sparing memory.
  • You can use rank-sparing memory with single multi-rank DIMMs.
  • Rack-sparing memory on one channel is independent of the sparing on all other channels.
  • You can use the Setup utility to determine the status of the DIMM ranks.
  • If you install LR-DIMMs, more than one rank is held in reserve.
  • Rank sparing is not supported when mirroring is enabled.

Install DIMMs in the order that is indicated in the following table for independent-channel mode.

Table 2. DIMM population sequence for independent-channel mode.

DIMM order	DIMM connector
1	DIMM 28
2	DIMM 45
3	DIMM 10
4	DIMM 15
5	DIMM 4
6	DIMM 21
7	DIMM 33
8	DIMM 40
9	DIMM 25
10	DIMM 48
11	DIMM 7
12	DIMM 18
13	DIMM 1
14	DIMM 24
15	DIMM 36
16	DIMM 37
17	DIMM 29
18	DIMM 44
19	DIMM 11
20	DIMM 14
21	DIMM 5
22	DIMM 20
23	DIMM 32
24	DIMM 41
25	DIMM 26
26	DIMM 47
27	DIMM 8
28	DIMM 17
29	DIMM 2
30	DIMM 23
31	DIMM 35
32	DIMM 38
33	DIMM 30
34	DIMM 43
35	DIMM 12
36	DIMM 13
37	DIMM 6
38	DIMM 19
39	DIMM 31
40	DIMM 42
41	DIMM 27
42	DIMM 46
43	DIMM 9
44	DIMM 16
45	DIMM 3
46	DIMM 22
47	DIMM 34
48	DIMM 39

Install DIMMs in the order that is indicated in the following table for lockstep mode.

Table 3. DIMM population sequence for lockstep mode.

Number of DIMM pairs installed	DIMM connectors
1st	DIMMs 25 and 28
2nd	DIMMs 45 and 48
3rd	DIMMs 7 and 10
4th	DIMMs 15 and 18
5th	DIMMs 1 and 4
6th	DIMMs 21 and 24
7th	DIMMs 33 and 36
8th	DIMMs 37 and 40
9th	DIMMs 26 and 29
10th	DIMMs 44 and 47
11th	DIMMs 8 and 11
12th	DIMMs 14 and 17
13th	DIMMs 2 and 5
14th	DIMMs 20 and 23
15th	DIMMs 32 and 35
16th	DIMMs 38 and 41
17th	DIMMs 27 and 30
18th	DIMMs 43 and 46
19th	DIMMs 9 and 12
20th	DIMMs 13 and 16
21st	DIMMs 3 and 6
22nd	DIMMs 19 and 22
23rd	DIMMs 31 and 34
24th	DIMMs 39 and 42

Install DIMMs in the order that is indicated in the following table for independent-channel mode with mirrored-channel memory.

Table 4. DIMM population sequence for independent-channel mode with mirrored-channel memory.

Number of DIMM pairs installed	DIMM connectors
1st	DIMMs 4 and 28
2nd	DIMMs 21 and 45
3rd	DIMMs 10 and 33
4th	DIMMs 15 and 40
5th	DIMMs 1 and 25
6th	DIMMs 24 and 48
7th	DIMMs 7 and 36
8th	DIMMs 18 and 37
9th	DIMMs 5 and 29
10th	DIMMs 20 and 40
11th	DIMMs 11 and 32
12th	DIMMs 14 and 41
13th	DIMMs 2 and 26
14th	DIMMs 23 and 47
15th	DIMMs 8 and 35
16th	DIMMs 17 and 38
17th	DIMMs 6 and 30
18th	DIMMs 19 and 43
19th	DIMMs 12 and 31
20th	DIMMs13 and 42
21st	DIMMs 3 and 27
22nd	DIMMs 22 and 46
23rd	DIMMs 9 and 34
24th	DIMMs 16 and 39

Install DIMMs in the order that is indicated in the following table for lockstep mode with mirrored-channel memory.

Table 5. DIMM population sequence for lockstep mode with mirrored-channel memory.

Number of DIMM pairs installed	DIMM connectors
1st	DIMMs 1, 4, 25, and 28
2nd	DIMMs 21, 24, 45, and 48
3rd	DIMMs 7, 10, 33, and 36
4th	DIMMs 15, 18, 37, and 40
5th	DIMMs 2, 5, 26, and 29
6th	DIMMs 20, 23, 44, and 47
7th	DIMMs 8, 11, 32, and 35
8th	DIMMs 14, 17, 38, and 41
9th	DIMMs 3, 6, 27, and 30
10th	DIMMs 19, 22, 43, and 46
11th	DIMMs 9, 12, 31, and 34
12th	DIMMs 13, 16, 39, and 42

To install a DIMM, complete the following steps:

1. Remove the cover (see Removing the compute node cover).
2. Read the documentation that comes with the DIMM.
3. Remove the air baffle installed over the DIMM connector.
4. Locate the DIMM connectors (see System-board connectors). Determine in which DIMM connector you want to install the DIMM.
5. Touch the static-protective package that contains the DIMM to any unpainted metal surface on the Lenovo Flex System chassis or any unpainted metal surface on any other grounded rack component in the rack in which you are installing the DIMM for at least 2 seconds; then, remove the DIMM from the package.
   
   
6. Make sure that both retaining clips on the DIMM connector are in the open position.
7. Turn the DIMM so that the DIMM keys align correctly with the DIMM connector on the system board.
   Attention: To avoid breaking the retaining clips or damaging the DIMM connector, handle the clips gently.
8. Press the DIMM into the DIMM connector. The retaining clips lock the DIMM into the connector.
9. Make sure that the small tabs on the retaining clips engage the notches on the DIMM. If there is a gap between the DIMM and the retaining clips, the DIMM has not been correctly installed. Press the DIMM firmly into the connector, and then press the retaining clips toward the DIMM until the tabs are fully seated. When the DIMM is correctly installed, the retaining clips are parallel to the sides of the DIMM.
10. Install the air baffle over the DIMM connector.
    Attention:

    • Install the air baffles with the arrow indicating air flow direction pointing to the rear of the compute node.
    • To maintain proper system cooling, do not operate the compute node without air baffles installed over the DIMM connectors.