Features and specifications

Use this information to view specific information about the compute node, such as compute node hardware features and the dimensions of the compute node.

Note:
  1. Power, cooling, and chassis systems management are provided by the Flex System chassis.
  2. The operating system in the compute node must provide USB support for the compute node to recognize and use USB media drives and devices. The Flex System chassis uses USB for internal communication with these devices.

The following table is a summary of the features and specifications of the x240 Compute Node Types 7162 and 2588.

Table 1. Features and specifications.

The features and specifications table is a two-column table where each column lists the features and specifications of the x240 Compute Node Types 7162 and 2588.

Features and specifications

Microprocessor:

  • Maximal: two multi-core IntelXeon microprocessors

  • Minimal: one multi-core IntelXeon microprocessor

Note: Use the Setup utility to determine the type and speed of the microprocessors in the compute node.
Integrated functions:
  • Renesas SH7757 (IMM2) baseboard management controller (BMC) with integrated VGA controller
  • (Models with embedded virtual fabric only) integrated dual-port 10 Gigabit Ethernet controller
  • Light path diagnostics
  • Automatic server restart (ASR)
  • One LSI 2004 SAS controller with support for RAID level-0 or RAID level-1 (does not support LINK function)
  • Optonal ServeRAID M5115 SAS/SATA controller (supports LINK function)
  • One external USB port
  • Support for up to two internal USB ports
  • Serial over LAN (SOL)
  • Wake on LAN (WOL)
Memory:
  • 24 dual inline memory module (DIMM) connectors
  • Minimal: one DIMM
  • Type: Low-profile (LP) double-data rate (DDR3) DRAM
  • Supports 2 GB, 4 GB, 8 GB, 16 GB, and 32 GB DIMMs with up to 768 GB of total memory on the system board
  • Support for RDIMMs, UDIMMs, and LRDIMMs (combining is not supported)
Predictive Failure Analysis (PFA) alerts:
  • Microprocessors
  • Memory
  • Hard disk drives

Drives: Supports up to two hot-swap, small form factor (SFF) Serial Attached SCSI (SAS) or Serial ATA (SATA) hard disk drives.

Upgradeable firmware: All firmware is field upgradeable.

Security: Fully compliant with NIST 800-131A. The security cryptography mode set by the managing device (CMM, Lenovo XClarity Administrator or Flex System Manager management node) determines the security mode in which the compute node operates.

Size:
  • Height: 55.5 mm (2.19 in)
  • Depth: 492.7 mm (19.38 in)
  • Width: 217.35 mm (8.56 in)
  • Maximum weight: 7.07 kg (15.6 lb)
Environment: The x240 Compute Node Types 7162 and 2588 complies with ASHRAE class A3 specifications.
  • Power on1:
    • Temperature: 5°C - 40°C (41°F - 104°F)2
    • Humidity, non-condensing: -12°C dew point (10.4°F) and 8% - 85% relative humidity3,4
    • Maximum dew point: 24°C (75°F)
    • Maximum altitude: 3048 m (10,000 ft)
    • Maximum rate of temperature change: 5°C/hr (41°F/hr )5
  • Power off6:
    • Temperature: 5°C to 45°C (41°F - 113°F)
    • Relative humidity: 8% - 85%
    • Maximum dew point: 27°C (80.6°F)
  • Storage (non-operating):
    • Temperature: 1°C to 60°C (33.8°F - 140°F)
    • Altitude: 3050 m (10,006 ft)
    • Relative humidity: 5% - 80%
    • Maximum dew point: 29°C (84.2°F)
  • Shipment (non-operating)7:
    • Temperature: -40°C to 60°C (-40°F - 140°F)
    • Altitude: 10,700 m (35,105 ft)
    • Relative humidity: 5% - 100%
    • Maximum dew point: 29°C (84.2°F)8
  • Particulate contamination
    Attention: Airborne particulates and reactive gases acting alone or in combination with other environmental factors such as humidity or temperature might pose a risk to the compute node. For information about the limits for particulates and gases, see Particulate contamination.
  1. Chassis is powered on.
  2. A3 - Derate maximum allowable temperature 1°C/175 m above 950 m.
  3. The minimum humidity level for class A3 is the higher (more moisture) of the -12°C dew point and the 8% relative humidity. These intersect at approximately 25°C. Below this intersection (~25°C), the dew point (-12°C) represents the minimum moisture level; above the intersection, relative humidity (8%) is the minimum.
  4. Moisture levels lower than 0.5°C DP, but not lower -10°C DP or 8% relative humidity, can be accepted if appropriate control measures are implemented to limit the generation of static electricity on personnel and equipment in the data center. All personnel and mobile furnishings and equipment must be connected to ground via an appropriate static control system. The following items are considered the minimum requirements:
    1. Conductive materials (conductive flooring, conductive footwear on all personnel who go into the datacenter; all mobile furnishings and equipment will be made of conductive or static dissipative materials).
    2. During maintenance on any hardware, a properly functioning wrist strap must be used by any personnel who contacts IT equipment.
  5. 5°C/hr for data centers employing tape drives and 20°C/hr for data centers employing disk drives.
  6. Chassis is removed from original shipping container and is installed but not in use, for example, during repair, maintenance, or upgrade.
  7. The equipment acclimation period is 1 hour per 20°C of temperature change from the shipping environment to the operating environment.
  8. Condensation, but not rain, is acceptable.